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0.1mm No-clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5

  • Description
Product Detail

    Product Details

    No-clean flux core wire solder 0.1mm~3.0mm BBIEN LF-01 Sn96.5Ag3.0Cu0.5

    Brief Introduction for LF-01 Sn96.5Ag3.0Cu0.5 solder wire

    The solder wire LF-01 Sn96.5Ag3.0Cu0.5 is tin based lead freeno clean solder wire,it is a new development for automated,robotized and manual high tech soldering.Its very low flux spitting guaranties a minimum of equipment cleaning while increasing the soldering quality.The solder wire flux is based on a halide activated synthetic resin composition,which ensures his good wetting properties.

    Soldering Advantage

    Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort are maintained.All this translates to a safe and environmentally compliant product that is operator friendly while maintaining high levels of productivity.

    BBIEN LF-01 Sn96.5Ag3.0Cu0.5 made 0.1mm~3.0mm no clean soldering wire is recommended for use in any hand soldering application where high flux activity is desired.

    It was developed to provide superior wetting performance for hand soldering in the

    electronics industry.The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes.The use of LF-01 silver solder wire results in an extremely clear post-soldering residue without cleaning.The unique chemistry in Sn96.5Ag3.0Cu0.5 was also designed to reduce spattering common to most core fluxes.Sn96.5Ag3.0Cu0.5 can be used for both leadbearing and lead-free soldering.

    Application

    The BBIEN LF-01 Sn96.5Ag3.0Cu0.5 Pb free solder wire is suitable for both manual and machine soldering of electrical and electronic components.The flux residues do not need to be removed.

    Sn96.5Ag3.0Cu0.5 lead free no clean solder wire is specifies compliance to the IPC J-STD-004B ROL0 standard.It is ideal for electronic assemblies used in tomotive,Consumer Electronics,Computer and peripherals,Mobile devices and all types of Au household appliance applications.As well as apply to High-precision medical instrumentation.

    Application notes

    Use a soldering iron tip size and form to suit the operation:

    small tips for soldering large components may prevent the formation of a joint or slow the process down.

    Select a solder wire diameter to suit both the soldering iron tip and the parts/components to be soldered.

    Soldering iron systems should provide sufficient heat to satisfy the requirements of the points above.A typical solder tip temperature would be between 215°C and 235°C above the liquidus temperature of the alloy.

    The ideal temperature to use is depend on how thermally demanding the assembly is.Cored solder wires can be provided in different grades of alloy so always ensures that you have selected the right gradefor the application.

    Feature of Sn96.5Ag3.0Cu0.5 soldering wire

    High temperature anti-oxygen satisfactory soldering joint and favorable fluidity.Solder joints are filled,and firm.Both RA and RMA are made in compliance with IPC J-STD-006 and JIS Z3283 class AA standards.All these solder flux can be dissolved in solvent,featuring a little smoke and very few splatters.

    Diameter:above 0.1mm(0.1mm,0.2mm,0.3mm,0.4mm,0.5mm,0.8mm,1.0mm…)

    Very fast wetting;Very low flux spatter

    Good spread characteristics

    Very low levels of fumes

    Clear non-tacky residue

    Provides good joint appearance

    Halogen and Halide Free

    Performance Characteristics:

    Colorless translucent residues

    Improves wetting performance

    Excellent solderability and fast wetting to a variety of surface finishes

    Eliminates the need and expense of cleaning

    Low smoke and odor

    Low spattering

    Compatible with leaded and lead-free alloys

    Classified as ROL0 per J-STD-004

    Compliant to Bellcore GR-78

    96.5Ag3.0Cu0.5(SAC305)soldering wire is low tendency of spitting,transparent residues and high thermal capacity,it produces very clean solder joints.As there is nearly no spitting,your soldering machine requires less servicing and you will have less shutdown periods.

    Availability

    Sn96.5Ag3.0Cu0.5 lead free silver soldering wire is available in a wide variety of types and sizes.

    1. Flux core type of solder wire and no flux core(solid)type of solder wire

    2. No clean type of silver solder wire

    3. Halogen-free type of solder wire and haloids type of solder wire.

    4. Acid type of solder wire

    5. 0.1mm ultrafine solder wire

    6. Many sizes of 0.15mm,0.2mm,0.3mm,0.5mm…3.0mm solder wires are all available

    Flux core percentage are1.1%,2.2%and 3.3%.

    Packing size

    The tin solder wire could be classified as reel packing and tube packing type.
    Each spool/roll holds the solder wire is 500g;
    Each tube can load the solder wire is 13g/piece
    Packing:

    Specification

    core solder wire/solid wire

    Appearance

    Bright alloy appearance

    Packing

    50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbin;10kg/carton:40kg/carton

    Tube packing:13g/tube

    Size of 10kg carton:36x18x8cm

    Size of 30kg carton:36x18x26cm

    Cleaning

    BBIEN LF-01 SAC305 Pb free solder wire’s flux residues are non-corrosive,non-conductive and do not require removal in most applications.IPA will not clean the residues off the surface of the circuit board after the soldering process.

    Storage and Shelf Life

    The shelf life of NNIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean solder wire is based on the chemistry of the flux core and the protective alloy covering of the wire.

    When stored in a dry,non-corrosive environment between 10°C-40°C(50-104°F),the shelf life of wire may be nearly

    Flux-cored solder wires alloys have a 1-3 year warranty from the date of manufacture.

    Over time,the surface of wire may lose its shine and appear a dull shade of gray.This is a surface phenomenon and is not detrimental to product functionality.

    Exported Countries

    Until now,BBIEN’S LF-01 Sn96.5Ag3.0Cu0.5 lead free no clean silver solder wire have been exported to many countries,e.g.America,South Korea,Japan,France,Germany…We are appreciated you are the next clients/cooperator with BBIEN.

    Other information

    Payment generally with T/T;L/C at sight is acceptable,Western Union and Paypal are also available.

    OEM logo can be discussed with MOQ.

    Delivery time:within 7working days after confirming payment if quantity bellowing 10 tons

    Production ability:more than 80tons each month for normal diameter above 1.0mm,1kg/spool.Other sizes please contact BBIEN.

    Certificate:SGS,ISO9001:2008;RoHS,REACH

    Technical Datasheet

    No-clean flux core wire solder BBIEN LF-01 Sn96.5Ag3.0Cu0.5

    Specification Data

    Product Type

    Solder wire Sn96.5Ag3.0Cu0.5

    Brand

    BBIEN

    Material

    Tin-Silver-Copper alloy

    Composition

    Sn,Ag,Cu

    Melt point

    217degree

    Flux content

    1.5%,2.0%,3.0%or no flux

    Application

    Metal soldering,electronics

    Density(g/m^3)

    8.3

    Diameter

    0.1mm,0.2mm,0.3mm,0.4mm,0.5mm,0.7mm,0.8mm,1.0mm,1.2mm,1.5mm.2.0mm.3.0mm

    Weight

    1000g/pcs,500g/reel,250g/roll;100g,50g

    Type

    No clean Pb free solder wire

    Place of origin

    Guang dong,China

    Certificate

    SGS

    Keyword

    Tin silver copper lead free solder wire

    Solder wire;no clean solder

    Solder

    Packing Details Information

    Specification

    core solder wire/solid wire

    Appearance

    Bright alloy appearance

    Packing

    50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbion;10kg/carton:30kg/carton

    Tube packing:13g/tube

    Size of 10kg carton:36x18x8cm

    Size of 30kg carton:36x18x26cm

    50g/roll:240rools/export carton:G.W-14kg;Size of Carton:36*26*18cm

    100g/roll:120rolls/export carton:G.W-13.5kg Size of Carton:36*26*18cm

    200g/roll:120rolls/export carton:G.W-26.5kg Size of Carton:36*26*18cm

    500g/roll:51/rolls export carton:G.W-27.5kg Size of Carton:36*26*18cm

    1kg/roll:40rolls/export carton:G.W-41.5kg Size of Carton:36*26*18cm

    Specification and chemistry component

    Specification

    Sn99-Ag3.0-Cu0.5

    Appearance

    Lucent,no dirt on wire surface

    Chemistry component

    Sn

    Ag

    Cu

    Pb

    Sb

    Bi

    Zn

    Fe

    Al

    As

    Cd

    96.5

    3.0

    0.5±0.2

    <0.01

    <0.02

    <0.01

    <0.003

    <0.02

    <0.001

    <0.03

    <0.002

    Physical Characteristic

    Alloy component

    Melting point

    Proposion g/cm3

    Rigidity HB

     

    Conduct heat

    M.S.K

    Extend

    Mpa

    Extend

    rate

    %

    Conductivity%

    Sn96.5Ag3.0Cu0.5

    217

    7.4

    9

    64

    32

    48

    16.0

    Advantage And Service

    0.1mm no-clean flux core wire solder BBIEN LF-01 Sn96.5Ag3.0Cu0.5

    Products Advantage

    .BBIEN is specialized in soldering industry from 2000, known as a experienced tin lead and lead free solder wire manufacturer, whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for pb and pb free solder wire industry,until now,we accumulate much valuable experience,five senior solder wire engineers operate a specialized reflowing solder wire production.

    High temperature no clean solder wire TL-01 BBIEN Sn96.5Ag3.0Cu0.5 offers excellent solderbility,wettibility and reliability among leaded Pb contained solder wire, it is available in a wide product lineup according to the required soldering temperature.

    Due to sophisticated technical in Sn-Ag-Cu alloy,BBIEN can supply the thinnest diameter size to 0.1mm for TL-01 BBIEN SAC305,SAC0307,SnCu0.7 no clean solder wire, normal size such as 0.2mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm,2.0mm solder wires are all available.

    TL-01 BBIEN SAC305 tin-silver-copper no clean solder wire can be not only applied to tradional electronics pcb,electronics soldering,but also its application for some new hi-tech industry, semiconductor. LED, aerospace, automotive.

    BBIEN TL-01Sn96.5Ag3.0Cu0.5 (SAC305) high temperature 217 degree Celsius RoHS standard soldering wire can be packaged with spool ,general 500g,1000g which is used for both hands soldering and air soldering technique;it can also be packed with 15g tube,name tube soldering wire.

    Thanks to BBIEN long-term unremitting R&D for solder technique,until now,BBIEN have the following high-tech solder product for different lead free alloy.

    No clean lead-free solder

    melting point °C

    Tensile strength

    elongation reat%

    expansion rate%

    Diameter

    Application

    Solder wire alloy

    Solder bar/block alloy

    Solder paste alloy

    Solder powder alloy

    Sn99.3Cu0.7

    227

    30

    45

    70

    =0.1mm

    low cost, the most commonly used;
    Lead-free solder for general welding

    yes

    yes

    yes

    yes

    Sn96.5Ag3.0Cu0.5

    217

    40

    58

    78

    =0.1mm

    high cost, relatively bright spot;

    high performence

    Can be excellent for demanding welding
     

    yes

    yes

    yes

    yes


    Sn99.0Ag0.3Cu0.7

    Sn64Bi35Ag1

    189

    40

    50

    70


    SMT,PCB

    yes

    not

    yes

    yes

    Sn62Pb36Ag2

    189

    38

    54

    75


    SMT,PCB

    yes

    not

    yes

    yes

    Sn42Bi58

    138

    38

    50

    75

    =0.5mm

    High cost

    yes

    not

    yes

    yes

    Shipping Advantage

    Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety,quickly and efficiently.

    Shipment can be deliveried once placing order 2 to 10 working days.

    Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

    Technical Advantage

    BBIEN can share the datasheet for our product to our clients.

    Certificates of compliance,SGS,ISO and COA,MSDS,are available.

    We are tyring to make our product quality system more and more complete,BBIEN also appreciate your precious suggestion.

    Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully, quickly, technical support is available.

    Service

    When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours.And solve your problem on solder products.

    OEM is available according to your own logo.

    Return back to society

    BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

    Payment way:

    A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

    BBIEN Technology is one of the professional manufacturers and suppliers of 0.1mm no-clean flux core wire solder sn96.5ag3.0cu0.5. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price 0.1mm no-clean flux core wire solder sn96.5ag3.0cu0.5 made in China. Pricelist and quotation consultation are available if you need.

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Shenzhen BBIEN Technology Co.,Ltd

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