High Temperature Solder Paste SACX0307

Product Detail

Product Details

Brief Description for LF-02 SACX0307 solder paste

Solder paste is prepared by kneading solder powder and solder flux and is used for surface mounting PC boards. BBIEN’S solder paste is a combination of solder powder without oxidation in a uniform particle size and flux with excellent chemical stability.

BBIEN‘s Sn99Ag0.3Cu0.7 solder paste is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of this solder paste  will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, SAC0307 will leave aesthetically pleasing clear residues on the assembly. Sn99Ag0.3Cu0.7 is designed for a high range of temperature and humidity conditions. 

Flow Chart for Quality Guarantee:

Material Inspection ( a. Our QA Department   b. National Certification Department Note: Major material ) ?Flux character Inspection? Process products ? Solder Paste Inspection ? Solder Paste Package Inspection ? Finished Products Inspection ? Shipment Choice Inspection .

Physical Properties

(Data given for Sn99Ag0.3Cu0.7, 90% metal, -325+500 mesh)Data representative for most SnAgCu compositions

Standard Applications(For stencil printing)	88.0% metal for -325+500 mesh 87.5% metals for -400+500 mesh
Viscosity (typical)	1500 poise (-325+500 mesh) 1550 poise (-400+500 mesh) Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical)	27 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test	Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test	Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Copper Mirror Corrosion	Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test	Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Application

BBIEN SAC0307 high temperature lead free solder paste is ideal used for precious computer motherboard, phone motherboard, printed circuit board (PCB), LED and SMT technique,as well as high-precision electronics circuit board. solder paste,

Packing

The SAC0307 high temperature lead free solder paste could be classified as can/bottle packing and syringe packing type.

Each can/bottle holds the solder cream is 500g;

Each syringe can load the solder cream is 100g

The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.

Size of carton:36*28*30cm hold with net weight of 10kg

Cleaning

LF-02 SACX0307 solder paste is a no-clean formula lead free solder paste.The residues do not need to be removed for typical applications. Although

LF-02 SACX0307 solder paste is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.

Available types

BBIEN solder factory can supply many types of LF-02 SACX0307 no clean solder paste,standers paste composition size as following formular:

Pitch printing	IPC no.	Metal alloy powder size	Powder content
Regular pitch printing	Type3	25~45 µm	89 %
Regular printing	Type4	20~38 µm	88.5 %
Fine pitch printing	Type5	15~25µm	85 %
Ultrafine pitch printing	Type6	10~18µm	88.5 %
Ultrafine pitch printing	Type7	2~12µm	88.5 %

Products Photos









Technical Datasheet

Technical of high temperature solder paste LF-02 SACX0307

The recommended reflow profile for LF-02 SACX0307 no clean solder paste made with the SAC allous is shown here. This profile is simply a guideline.

Specification and chemistry component

Item name	Chemical composition (wt.%)
	Sn	Pb	Sb	Cu	Bi	Ag	Fe	Al	Cd
Sn99Ag0.3Cu0.7	Bal.	< 0.10	<0.10	0.7+/_0.1	<0.10	0.3±0.05	<0.02	<0.002	<0.002

Compare with other Sn/Ag/Cu alloy solder paste(Physical Speciality)

Sort	(?) Melting Point	g/cm3 Spec. Gravity	MPa Tensile Strength
SAC305	217-227?	7.64	53.3
SACX0307	225~230?	7.46	51.3
SAC105	215~230?	7.52	52.3

Packing details:

Specification	Sn99-Ag0.3Cu0.7
Appearance	Black and gray tacky paste
Weight	500g/jar;100g/syringe 10kg/ctn

Reflow formular

Heating rate	The time required to 130 ºC	constant tem. 130 - 170ºC	peak tem.	> 217°C	cooling rate
1-3 ºC/sec	< 60—90secs	60—120secs	240 ±10ºC	< 40—80secs	<4ºC / S

 (Recommended reflow process parameters)

 

LF-02 SACX0307 solder paste recommended reflow soldering temperature profile

Using notes:

Storage, handling and shelf life In general,LF-02 SACX0307 solder paste is stored in 2 ? -8 ? temperature refrigeration, Shelf life: six months (starting from the date of manufacture), goods should follow the FIFO principle.

Open the package using the solder paste is necessary before fully warmed to room temperature (recommended for 4 hours); return temperature for 48 hours in the retention period, after opening a period of 12 hours, stay in the solder paste reflow PCB board to have pre- idle time is 100 ± 20 minutes.

Cold storage may cause the separation of components within the solder paste, solder paste is stirred well before use 3 to 5 minutes to re-mix. (Recommended: automatically stir 3 ± 0.5 minutes, hand-mixing 5 ± 1 minute, mixer speed: revolution 400rpm, rotation 100rpm)

 Do not use the leftover solder paste mixed with the new packaging in the same bottle. Without the use of solder paste should be re-sealed, when the cap can not be sealed very well replace the cap when the sealing liner to ensure that as much as possible.

Feature

LF-02 lead free solder paste SACX0307 can supply outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance.

BBIEN’S LF-02 no clean stencil and joint dispensing solder paste is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields.

BBIEN’S LF-02 lead free silver high temperature solder paste is capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

• Low voiding behavior

• Probe friendly residues,and environmental friendly type of solder paste

• Capable of print speeds up to 200 mm/sec

• Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs

• Excellent release from stencil

• Long stencil and tack life (process dependent)

• Probe friendly residues

• Capable of 60 minute break times in printing

• Clean cosmetic aesthetics after reflow

• Resistant to slump

• Reflowable in air or nitrogen

• Classified as ROL0 per J-STD-004

Advantage And Service

Products Advantage

high temperature no clean solder paste LF-02 SACX0307(Sn99Ag0.3Cu0.7)offers high solderbility,wettibility and reliability, it is available in a wide product lineup according to the required soldering temperature.

BBIEN is specialized in soldering industry from 2000, known as a experienced solder manufacturer,whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.

Due to sophisticated technical in Sn-Ag-Cu alloy,BBIEN can supply the thinnest size of type7(5~12micron) for LF-02 SACX0307 no clean solder paste, normal size such as type6,type5,type4 and type3 are also available.

LF-02 SACX0307(Sn99Ag0.3Cu0.7) silver no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor.LED,aerospace,automotive.

LF-02 SACX0307(Sn99Ag0.3Cu0.7) high temperature solder paste can be packaged with jar 50,500g,which is used for stencil soldering;it can also be packed with 100g joint syringe tube used for  dispensing soldering.

Technical Advantage

BBIEN can share the datasheet for our product to our clients.

Certificate of compliance,SGS,ISO and COA,MSDS,are available.

We are tyring to make our product quality system more and more complete, BBIEN also appreciate your precious suggestion. 

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular and normal go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.

OEM is available according to your own logo.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

BBIEN Technology is one of the professional manufacturers and suppliers of high temperature solder paste sacx0307. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price high temperature solder paste sacx0307 made in China. Pricelist and quotation consultation are available if you need.