138 Degree Melting Low Temperature Solder Paste Sn42Bi58

Product Detail

Product Details

138degree melting low temperature solder paste LF-05 Sn42Bi58

Brief Description for LF-05 Sn42Bi58

LF-05 Sn42Bi58 Pb-free tin bismuth solder paste is designed to enable low temperature surface mount assembly technology. The lead-free alloy in LF-05 Sn42Bi58 has a melting point 138°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from LF-05 Sn42Bi58 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards and get good reflowing soldering process result.

Energy-saving by reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care.

Usage of Sn42-Bi58 Solder Paste

The Sn42Bi58 Bi series is designed to meet requirements for reliable solder joints in SMT PC board assemblies, this lead free no clean Bi solder paste can also apply for household-electrical products,which including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others.

Exported countries:

Pakistan,UAE,South Korea,America,Mid-east countries,Brazial,India,Iran,Egype,Turkey

Greater Print Definition

Microprint's small particle size of 5-45µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga work

Type3 solder paste	25~45µm
Type4 solder paste	22~38µm
Type5 solder paste	15~25µm
Type6 solder paste	10~18µm
Type7 solder paste	5~12µm

Packing Details:

Packing could be classified as can/bottle packing and syringe packing type.
Each jar/bottle holds the solder paste is 500g,50g;
Each cartridge can load the solder paste is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.

Customized logo:can be available when MOQ above 500kg

Production ability:2tons each week

Stencil Life And Cleaning

> 8 hours @ 30-45% RH and 20-25 oC

~ 4 hours @ 45-75% RH and 20-25 oC

Cleaning

BBIEN LF-05 low temperature tin bi solder paste Sn42Bi58 is no clean type of soldering paste, belongs to environmental friendly solder materials. Sn42Bi58can also be cleaned using commercially available flux residue removers such as cleaning flux ,which is available from BBIEN.

Storage, Handling, and Shelf Life:

Keep solder paste into refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,

reflow characteristics, and overall performance.Sn42-Bi58 stencil and dispensing solder paste/cream should be stabilized at room temperature prior to printing. R520A should be kept at standard refrigeration temperatures, 3-8°C Please contact BBIEN if you require additional advice with regard to storage and handling of this material. Shelf life is general 6months from date of manufacture and held at 3-8°C

Photos of Sn42-Bi58 LF-05 no clean bi solder paste









Technical Datasheet

LF-05 Sn42Bi58 Solder Paste RoHS Compliance

This product meets the requirements of the RoHS(Restriction of Hazardous Substances) Directive,2002/95/EC Article 4 for the stated banned substance.

BELLCORE AND J-STD TESTS & RESULTS

BELLCORE AND J-STD TESTS & RESULTS
Test	Result	Test	Result
J-STD-004A (IPC-TM-650)		J-STD-005 (IPC-TM-650)
Flux Type (per J-STD-004A)	ROL0	Typical Solder Paste Viscosity Malcom (10rpm)	1300 poise
Flux Induced Corrosion (Copper Mirror)	Type L	Slump Test	Pass
Presence of Halide Oxygen Bomb followed by ion chromatography	<50ppm Br - <50ppm Cl -	Solder Ball Test	Pass
		Typical Tackiness	35g
		Wetting Test	Pass
SIR	Pass	BELLCORE GR-78
		SIR	Pass
		Electromigration	Pass

Technical Data Sheet

Specification and chemistry component

Specification	Sn42-Bi58
Appearance	Black Tacky paste
Packing	500g/jar;250g/jar;50g/jar;100g/cartridge tube

Sn42-Bi58 Metal Chemical Composition:

Sort	Chemical composition (wt.%)
	Sn	Bi	Ag	Pb	Fe	Cu	Al	Cd
Sn42-Bi58	42+/-1	58±1	<0.0002	<0.01	<0.002	<0.005	<0.0002	<0.002

 Physical Speciality

Sort	(?)  Melting Point	g/cm3 Spec. Gravity	MPa% Tensile Strength
Sn42-Bi58	138?	8.62g/cm3	38-48

Reflowing Chart of Sn42-Bi58 Low Temperature Solder Paste

Heating rate	The Time Required to 120 ºC	Constant Temperature 80 - 130ºC	Peak Temperature	> 180°C	Cooling Rate
1-3 ºC/sec	< 60—90secs	60—120secs	< 170 ±5ºC	< 40—80secs	<4ºC / S

 Recommended reflow process parameters

 

Using Note:

1. Open the package using the solder paste is necessary before fully warmed to room temperature (recommended for 4 hours); return temperature for 48 hours in the retention period, after opening a period of 12 hours, stay in the solder paste reflow PCB board to have pre- idle time is 100 ± 20 minutes.

2. Cold storage may cause the separation of components within the solder paste, solder paste is stirred well before use 3 to 5 minutes to re-mix. (Recommended: automatically stir 3 ± 0.5 minutes, hand-mixing 5 ± 1 minute, mixer speed: revolution 400rpm, rotation 100rpm).

3. Do not use the leftover paste paste mixed with the new packaging in the same bottle. Without the use of solder paste should be re-sealed, when the cap can not be sealed very well replace the cap when the sealing liner to ensure that as much as possible.

Feature

BBIEN LF-05 Sn42-Bi58 Pb-free no clean solder paste has following advantage feature:

1) Reduces thermal damage to components and substrate

Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.

2) High insulation reliability

The flux solvent volatilizes even in low temperature reflow, eliminating reduction in insulation resistance arising from inadequate volatilization. TB48-M742·T4AB48/58-M742 produces flux residue with high insulation reliability.

3) Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.

4) Reduces energy consumption in reflow ovens versus standard lead free alloys.

5) Reduces reflow process cycle time.

6) Delivers 8 Hour stencil life.

7) Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering.

8) Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)

Advantage And Service

BBIEN LF-05 Sn42-Bi58 Low Temperature Solder paste Products Advantage

Due to sophisticated technical in Sn-Bi alloy,BBIEN can supply the thinnest size of type7(5~12micron) for LF-05 Sn42-Bi58 Pb-free tin Bi soldering paste, normal size such as type6,type5,type4 and type3 are also available

LF-05 Sn42-Bi58 138 degree Celsius melting point no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor. LED,aerospace,automotive.

BBIEN solder paste factory have skilled technical to make solder whci can be applied for many different kinds of electronics,SMT,SMD,PCB.

.BBIEN is specialized in soldering industry from 2000, known as a experienced solder paste manufacturer, whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.

middle temperature no clean solder paste LF-05 Sn42-Bi58 offers high solderbility,wettibility and reliability, it is available in a wide product lineup according to the required soldering temperature.

LF-05 Sn42-Bi58 low temperature 138 degree Celsius solder paste can be packaged with jar 50,500g,which is used for stencil soldering; it can also be packed with 100g jet tube used for dispensing soldering.

Shipping Advantage

Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.

Shipment can be deliveried once placing order 2 to 10 working days.

Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.

Technique Advantage

Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully, quickly, technical support is available.

We are tyring to make our product quality system more and more complete, BBIEN also appreciate your precious suggestion. 

BBIEN can share the datasheet for our product to our clients.

Certificate of compliance,SGS,ISO and COA,MSDS,are available.

Service

When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.

OEM is available according to your own logo.

Payment way:

A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.

Return back to society

BBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.

BBIEN Technology is one of the professional manufacturers and suppliers of 138 degree melting low temperature solder paste sn42bi58. We have professional workers who have consummate skills producing high quality products in our factory. Welcome to buy our discount and low price 138 degree melting low temperature solder paste sn42bi58 made in China. Pricelist and quotation consultation are available if you need.